Overview of High pure Titanium Carbide TiC granule/power /plate /tube /Sputtering Target
Titaan (Ti) is a chemical element with the atomic number 22 and is symbolized as Ti on the periodic table. It belongs to the transition metals group and is known for its low density, high strength-to-weight ratio, and exceptional corrosion resistance. Discovered in 1791 by William Gregor, titanium has become a vital material across numerous industries due to its unique combination of properties.
Feature of High pure Titanium Carbide TiC granule/power /plate /tube /Sputtering Target
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Low Density and High Strength: Titanium is about 45% lighter than steel but possesses similar strength, making it ideal for applications where weight reduction is critical without compromising strength.
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Corrosion Resistance: It forms a passive oxide layer that protects the underlying metal from corrosive substances, including sea water and chlorine, making it highly resistant to corrosion.
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Biosobivus: Titanium is well-tolerated by the human body and doesn’t cause adverse reactions, which is why it’s widely used in medical implants and surgical instruments.
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Kuumakindlus: With a melting point of 1,668°C (3,034°F), titanium can withstand high temperatures, making it suitable for aerospace and automotive applications.
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Non-Magnetic and Non-Toxic: These properties make titanium ideal for applications in MRI machines and other sensitive electronic devices.
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Fatigue Resistance: Titanium demonstrates excellent resistance to metal fatigue, crucial in cyclic loading applications such as aircraft parts.
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(High pure Titanium Carbide TiC granule/power /plate /tube /Sputtering Target)
Parameters of High pure Titanium Carbide TiC granule/power /plate /tube /Sputtering Target
The high purity titanium carbide (TiC) granules, powders, plates, and tubes can be produced using sputtering targets, which are typically made of ceramic materials such as zirconia or cerium oxide.
The target parameter refers to the specific properties that determine how well the sputtered material will function in a particular application. Some common parameters include:
* Temperature: The temperature at which the sputtering process takes place is an important factor that affects the rate of sputtering and the final product’s properties.
* Pressure: The pressure at which the sputtering process takes place can also affect the properties of the sputtered material. Higher pressures can result in higher temperatures, but may also lead to faster sputtering rates and reduced surface quality.
* Alumina content: The presence of aluminum on the sputtering target can affect the sputtering behavior and final product properties.
* Koosseis: The composition of the sputtering target can affect its electrical conductivity, thermal stability, and mechanical properties.
Üldiselt, selecting the appropriate target parameter for a given application is critical for achieving optimal performance of the sputtered material. Engineers should consider factors such as material type, desired properties, and intended use when selecting the target parameter.
(High pure Titanium Carbide TiC granule/power /plate /tube /Sputtering Target)
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(High pure Titanium Carbide TiC granule/power /plate /tube /Sputtering Target)
