Overview of Whole titanium sputtering target
Titanio (Ti) leti' jump'éel elemento químico yéetel u meyaj ku atómico 22 yéetel ku chíikbesa'al bey Ti ti' le tabla periódica. ti' le múuch' metales transición yéetel leti'e' k'ajóolta'an tumen u baja densidad, ka'anal relación muuk'-peso, yéetel resistencia ti' le corrosión excepcional. Descubierto ti' 1791 tumen William Gregor, le titanio ts'o'ok u suut jump'éel ba'al jach k'a'anan ichil ya'abkach industria'ob tumen u chen combinación u propiedades.
Feature of Whole titanium sputtering target
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Baja densidad yéetel ka'anal muuk': Titanio jach yóok'ol 45% asab k'a'an ti' le acero ba'ale' yaan ti' jump'éel muuk' similar, beetik u jach ma'alob uti'al u aplicaciones tu'ux le reducción peso jach crítica xma' comprometer u muuk'.
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Resistencia ti' le corrosión: Ku beetik jump'éel capa óxido pasivo ku kanáantik le metal subyacente ti' sustancias corrosivas, ichil le je'elo'oba' yaan ja' k'áak'náab yéetel cloro, beetik u jach resistente ti' le corrosión.
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Biocompatibilidad: Le titanio jach ma'alob tolerado tumen u wíinkilal wíinik yéetel ma' causa reacciones adversas, le o'olal jach ku meyaj ti' implantes ts'aako'ob yéetel instrumentos quirúrgicos.
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Resistencia ti' le ooxoj: Yéetel jump'éel ch'aaj fusión 1,668°C (3,034°F), le titanio je'el u páajtal u soportar ka'anal temperatura, beetik u jach ma'alob uti'al u meyaj aeroespacial yéetel automotriz.
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Ma' magnético yéetel ma' tóxico: Le ba'alo'oba' ku beetiko'ob u titanio jach ma'alob uti'al u meyaj ti' máquinas MRI yéetel uláak' dispositivos electrónicos sensibles.
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Resistencia ti' le fatiga: Le titanio ku ye'esik jump'éel ma'alob resistencia ti' le fatiga metal, jach k'a'anan ti' aplicaciones u kuuch cíclica bey páajtal a péepenk'áak'o'.
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(Whole titanium sputtering target)
Parameters of Whole titanium sputtering target
The parameters of a whole titanium sputtering target refer to the factors that influence the performance and behavior of the target during sputtering processes. Some of the key parameters include:
1. Cross-section area: The cross-sectional area of the target determines its surface area, which affects the number of ions that can be impinging on it per unit time.
2. Critical current density: The critical current density is the minimum amount of current needed for ionization and deposition to occur at a given temperature. It is an important parameter for controlling the rate of sputtering processes.
3. Sputtering velocity: The sputtering velocity determines how quickly ions with different energies and charges can collide with the target. A higher sputtering velocity results in faster ionization and deposition rates.
4. Temperature: The temperature of the target determines the rate of sputtering and the properties of the deposited layer. Higher temperatures result in more rapid sputtering and deposition, but may also lead to greater thermal stress and damage to the material being sputtered.
5. Characteristic sputtering parameters: These are specific characteristics of the sputtering process that depend on the above parameters, such as the deposition rate, grain size, and purity of the deposited layer.
6. Beam profile: The beam profile of the sputtering beam is also important, as it affects the diffraction pattern of the deposited layer and can affect the thickness of the deposit.
Overall, understanding these parameters is crucial for optimizing the performance of a whole titanium sputtering target and achieving desired properties for industrial applications.

(Whole titanium sputtering target)
Perfil ti' le empresa
Metal Mummy jach jump'éel proveedor xooko'obo' químico global u confiable & fabricante yéetel asab u 12 ja'abo'ob yaan ti' kaambalo'ob ti' le ts'aik cobre super ka'anal calidad yéetel yik'áalil láak'tsilo'ob.
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